Diffusion in Copper and Copper Alloys, Part II. Copper-Silver and Copper-Gold Systems

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Abstract
A survey, comparison, and critical analysis is presented of data compiled from the scientific literature concerning diffusion in copper‐silver and copper‐gold systems. Here the term ``copper alloy system'' is interpreted in the broadest sense. For example, the review of diffusion in the Cu‐M system reports all diffusion situations which involve both copper and element M, including diffusion of Cu in M or in any binary, ternary, or multicomponent alloy containing M: diffusion of M in Cu or in any alloy containing Cu; and diffusion of any element in any alloy containing both Cu and M. Topics include volume diffusion, surface diffusion, grain boundary diffusion, tracer diffusion, alloy interdiffusion, electromigration, thermomigration, strain enhanced diffusion, and diffusion in molten metals. An extensive bibliography is presented along with figures, tabular presentation of data and discussion of results.

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