A novel die bonding adhesive-silver filled film
- 22 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 518-524
- https://doi.org/10.1109/ectc.1997.606218
Abstract
No abstract availableThis publication has 1 reference indexed in Scilit:
- Studies on tack of pressure-sensitive adhesive tapes: On the relationship between pressure-sensitive adhesion and surface energy of adherendsJournal of Applied Polymer Science, 1973