Residual Stress, Fracture, and Adhesion in Sputter-Deposited Molybdenum Films
- 1 January 1988
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 13 references indexed in Scilit:
- Technical note: Design and performance of a movable post-cathode magnetron sputtering system for making PBFA II accelerator ion sourcesSurface and Coatings Technology, 1987
- Nucleation and Growth of Stress Relief Patterns in Sputtered Molybdenum FilmsJapanese Journal of Applied Physics, 1986
- Microstructural and Chemical Components of Ceramic-Metal Interfacial Fracture EnergiesMRS Proceedings, 1986
- Decohesion of Thin Films From Ceramic SubstratesMRS Proceedings, 1985
- Stress relief forms of diamond-like carbon thin films under internal compressive stressThin Solid Films, 1984
- The embrittling effects of hydrogen on a variety of inorganic materials as indicated by acoustic emissionJournal of Materials Science, 1979
- Use of Fracture Mechanics Concepts in Testing of Film AdhesionPublished by ASTM International ,1978
- Thin-film Adhesion and Adhesive Failure—A PerspectivePublished by ASTM International ,1978
- Internal stresses in titanium, nickel, molybdenum, and tantalum films deposited by cylindrical magnetron sputteringJournal of Vacuum Science and Technology, 1977
- Stress Corrosion and Static Fatigue of GlassJournal of the American Ceramic Society, 1970