Efficient pulsed laser removal of 0.2 μm sized particles from a solid surface
- 20 May 1991
- journal article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 58 (20) , 2217-2219
- https://doi.org/10.1063/1.104931
Abstract
Laser cleaning with pulsed ultraviolet and infrared lasers is successfully employed to remove particulate contamination from silicon wafer surfaces and from delicate lithography membrane masks. Particulate material investigated include latex, alumina, silicon, and gold. Gold particles as small as 0.2 μm can be effectively removed. This new and highly efficient laser cleaning is achieved by choosing a pulsed laser with short pulse duration (without causing substrate damage), and a wavelength that is strongly absorbed by the surface; the removal efficiency is further enhanced by depositing a liquid film of thickness on the order of micron on the surface just before the pulsed laser irradiation.Keywords
This publication has 3 references indexed in Scilit:
- Laser-assisted micron scale particle removalApplied Physics Letters, 1991
- Adhesion and Removal of Fine Particles on SurfacesAerosol Science and Technology, 1987
- Mechanics of removing glass particulates from a solid surfaceSurface Technology, 1978