Investigation of the molecular processes controlling corrosion failure mechanisms in plastic encapsulated semiconductor devices
- 1 January 1981
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 21 (1) , 15-31
- https://doi.org/10.1016/0026-2714(81)90543-6
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Thermal decomposition of poly(butylene terephthalate)Journal of Polymer Science: Polymer Chemistry Edition, 1979
- Application of thermal analysisJournal of Electronic Materials, 1977
- Combined pyrolysis and radiochemical gas chromatography for studying the thermal degradation of epoxy resins and polyimides. I. The degradation of epoxy resins in nitrogen between 400°C and 700°CJournal of Applied Polymer Science, 1970