Microstructural evolution, microhardness and thermal stability of HPT-processed Cu
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- 18 August 2000
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 290 (1-2) , 128-138
- https://doi.org/10.1016/s0921-5093(00)00919-9
Abstract
No abstract availableKeywords
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