Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits

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Abstract
A simple mechanical model for a deposited film∕substrate couple is presented to describe how film deposition at an elevated temperature induces change in the substrate’s in-plane dimensions at room temperature. The model provides a quantitative guideline for reducing, or completely eliminating, this elongation, by tailoring the tensile built-in stress in the deposited film. The dimensional stability so achieved is necessary for accurate overlay alignment of photomasks during the fabrication of thin-film electronic circuits.

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