Mechanisms of Contact Failure in Semiconductor Devices

• 1 November 1967
• proceedings article
• Published by Institute of Electrical and Electronics Engineers (IEEE) in Fourth Annual Symposium on the Physics of Failure in Electronics
• https://doi.org/10.1109/irps.1967.362415

Abstract

Keywords

• SEMICONDUCTOR DEVICES
• SOLID SOLUTION
• TEMPERATURE
• DEGRADATION
• THERMAL CONDUCTIVITY
• CONTACT RESISTANCE
• SOLIDS
• THERMODYNAMICS
• OHMIC CONTACTS
• INTERMETALLIC