Inductive crosstalk between integrated passive components in RF-wireless modules
- 27 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
We show an example design of a cellular telephone that demonstrates the marked contrast between passive component usage in its base-band and radio sections. We discuss the performance demands that applications like these place on passive components and how these demands relate to the technology used to build the components. Recently, we have demonstrated and reported on the use of silicon-on-silicon thin film modules to integrate the tank resonator circuit of the 1 GHz UHF VCO in a GSM transceiver. We discuss some of the ways that these results can be extended to take further advantage of component integration. A unique characteristic of modules used in RF applications is the integration of thin-film spiral inductors. One of the concerns in the tight integration of these components is crosstalk arising from mutual inductive coupling between components. We have calculated the mutual inductive coupling between spiral inductors, with and without ground planes, and present representative examples from typical module designs.Keywords
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