Manufacturability of Chemical Vapor Deposition of Copper
- 1 August 1997
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 144 (8) , 2829-2833
- https://doi.org/10.1149/1.1837902
Abstract
A reliable and reproducible copper deposition process using the chemical vapor deposition technique has been successfully developed using hexafluoroacetylacetone‐based precursors. Effects of various process conditions such as temperature, distance from the wafer to the shower head, liquid precursor flow, etc., have been studied. Low resistivity (200 nm/min), good adhesion, and good gap fill are routinely achieved. The quality copper film has <1% variation within 25 wafer batches for more than 500 wafers tested. The resulting copper deposition process is considered ready for integration into a manufacturing line.Keywords
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