Abstract
A method of depositing inorganic coatings in a soft vacuum process is described. The basis of the method is a hot chamber which maintains pure and clean conditions. Dense, well adhered and relatively thick coatings may be obtained in a wide range of metals, alloys, and ceramics, etc. Both electron beam evaporation and sputter deposition were investigated and their merits are compared. The influence of substrate biasing during sputter deposition on coating morphology is especially important.

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