The Effect of Microstructure and Microcracking on the Thermal Conductivity of UO2‐U4O9
- 1 July 1979
- journal article
- Published by Wiley in Journal of the American Ceramic Society
- Vol. 62 (7-8) , 326-332
- https://doi.org/10.1111/j.1151-2916.1979.tb19070.x
Abstract
No abstract availableKeywords
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- Thermal Conductivity: XIV, Conductivity of Multicomponent SystemsJournal of the American Ceramic Society, 1959