Electromigration and the Current Density Dependence

• 1 March 1985
• proceedings article
• Published by Institute of Electrical and Electronics Engineers (IEEE) in 8th Reliability Physics Symposium
• https://doi.org/10.1109/irps.1985.362082

Abstract

Keywords

• VLSI
• TEMPERATURE
• CURRENT DENSITY
• MICROELECTRONICS
• INTEGRATED CIRCUITS
• STRESS
• SEMICONDUCTORS
• INTEGRATED CIRCUIT
• ELECTROMIGRATION
• CHIP
• METALLIZATION
• HEATING
• RELIABILITY