The ohmic stability and low temperature coefficient of resistance of Cu-Ni/Au-Ni multilayers obtained in ultrahigh vacuum by controlled co-evaporation

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1 March 1979

journal article
Published by Elsevier in Thin Solid Films

Vol. 57 (2) , 349-352
https://doi.org/10.1016/0040-6090(79)90177-9

Abstract

No abstract available

Keywords

This publication has 2 references indexed in Scilit:

Temperature and thickness dependence of the ohmic behaviour of Au-Ni thin films obtained by controlled UHV co-evaporation
Thin Solid Films, 1976
Stabilité et structure de couches minces d'alliage Cu-Ni de type constantan obtenues par biévaporation contrôlée en ultra-vide
Thin Solid Films, 1975