Metallurgical reactions at the interface of Sn/Pb solder and electroless copper-plated AlN substrate
- 1 August 1995
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 18 (3) , 537-542
- https://doi.org/10.1109/96.404113
Abstract
[[abstract]]Intermetallic formation between electroless-plated copper and Sn/Pb solder is investigated. An interlayer is formed between copper and solder, and segregation of Pb-rich and Sn-rich phases are observed. X-ray diffraction and EDX analysis results suggest that the major intermetallic formed in the interlayer is Cu6Sn5. For the as-plated sample, the adhesion strength of Cu to the AIN substrate after 150°C aging is affected by both the recrystallization and the creep of copper. For the soldered specimen, the presence of intermetallic compound causes cracks to propagate along the intermetallic/Cu interface and results in a decrease of the adhesion strength[[fileno]]2020323010165[[department]]材料科學工程學Keywords
This publication has 16 references indexed in Scilit:
- The formation and growth of intermetallics in composite solderJournal of Electronic Materials, 1993
- Published by Institute of Electrical and Electronics Engineers (IEEE) ,1993
- Recrystallization and mechanical properties of electroless copper. IScripta Metallurgica et Materialia, 1990
- Intermetallic formation on the fracture of Sn/Pb solder and Pd/Ag conductor interfacesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1990
- Plating of Copper into Through‐Holes and ViasJournal of the Electrochemical Society, 1989
- The Effect of Inclusions on the Ductility of Electroless Copper DepositsJournal of the Electrochemical Society, 1986
- A1N Substrates with High Thermal ConductivityIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1985
- Effects of Thiourea and Guanidine Hydrochloride on Electroless Copper PlatingJournal of the Electrochemical Society, 1985
- The Effect of pH on Electroless Copper DepositionJournal of the Electrochemical Society, 1983
- The Effect of Some Additives on Electroless Copper DepositionJournal of the Electrochemical Society, 1983