Wafer bonding with an adhesive coating

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Abstract
The assembly process for microelectromechanical systems often requires a wafer-joining process using low temperatures. In this work a bonding process investigated, which uses thin adhesive films to stack silicon wafers. The method can be extended to form patterned adhesive coatings using stamping technique. Characterization of the process has been carried out with respect to adhesion, hermeticity and chemical stability of the adhesive bond. In several applications this adhesive bonding process has been successfully applied to assemble sensors and actuators.

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