Growth Rate of Fine Grains Formed by Diffusion Induced Recrystallization in Ni Layer of Cu/Ni/Cu Diffusion Couples
- 1 January 1998
- journal article
- Published by Japan Institute of Metals in Materials Transactions, JIM
- Vol. 39 (1) , 218-224
- https://doi.org/10.2320/matertrans1989.39.218
Abstract
No abstract availableThis publication has 10 references indexed in Scilit:
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