1-to-42 optoelectronic interconnection for intra-multichip-module clock signal distribution

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Abstract
In this paper, we present a miniaturized compact three-dimensional optical fan-out interconnect suitable for wafer scale very large scale integrated multichip-module optical clock signal distribution. The demonstrated device employs a thin light-guiding substrate in conjunction with a two-dimensional (2D) optical hologram array. The parallel feature among fan-out beams and the planar compact structure convert the unsolvable three spatial and three angular multiple alignment problem into a single-step 2D planar one, which greatly enhances the packaging reliability. A new design scheme for reducing throughput power nonuniformity is presented for the first time. A 25 GHz 1-to-42 highly parallel fan-out interconnect was demonstrated with a signal to noise ratio of 10 dB.