Abstract
In conductive multi-plates such as printed circuit boards (PCB) or pin grid array (PGA) connectors of CPU ICs, EM fields should be analyzed because undesired coupling between Vias and Pins may occur. In addition, the shield effectiveness of the pin array in preventing the leakage of EM field should be estimated. In this paper, some examples are shown to prove that the analysis method for the scattering of a multi-wire system is effective. Some calculation results giving the electric near-field images are presented for thin-wire systems and multi-plate conductors. They clearly give the field pattern caused by scattering out of the pole conductors. These results will give intuitive estimations of the EMI and lead to better treatments in the design.

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