New Quantitative Measurements of IC Stress Introduced by Plastic Packages

1 April 1981

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE) in 8th Reliability Physics Symposium

No. 07350791,p. 74-80
https://doi.org/10.1109/irps.1981.362977

Abstract

New strain gauge test bars have been designed forming individual and bridge structures for silicon integrated circuits. They are used to quantitatively measure internal stress introduced in IC bars during packaging. The results show that unexpectedly high levels of stress are introduced as a function of plastic material selection as well as mold and cure temperatures of the materials. The stress can be reduced, and process control can be tightened by appropriate choice of packaging conditions. The importance for IC reliability and electrical performance is discussed.

Keywords

STRESS MEASUREMENT
PLASTIC INTEGRATED CIRCUIT PACKAGING
INTEGRATED CIRCUIT MEASUREMENTS
CIRCUIT TESTING
BARS
CAPACITIVE SENSORS
INTEGRATED CIRCUIT TESTING
BRIDGE CIRCUITS
SILICON
INTERNAL STRESSES

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