An XPS Study of the Locus of Failure Between PMDA-ODA Polyimide and SiO2Surface
- 1 January 1986
- journal article
- research article
- Published by Taylor & Francis in The Journal of Adhesion
- Vol. 19 (3-4) , 257-265
- https://doi.org/10.1080/00218468608071227
Abstract
This study was undertaken to determine the locus of failure between a fully cured (up to 400°C) PMDA-ODA polyimide and SiO2 surface. We have shown that an interfacial layer is formed between the bulk polyimide and the substrate surface. The chemistry of this 2 nm-thick layer is different from that of the polymer interface surface of the polyimide film and of the bulk polymer. The locus of failure is at the interface of the interfacial layer and the bulk polyimide film.Keywords
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