Fabrication of surface acoustic wave devices by using x-ray lithography

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Abstract
Surface acoustic wave (SAW) devices with 0.6 ∼ 1.7 μm pattern size (fo=287.5∼812.5 MHz) designed as band-pass filters (BPF) were fabricated by using x-ray lithography. An x-ray stepper SX-5 with a conventional source (Pd terget), high sensitive x-ray resist chlorinated polymethylstyrene (CPMS) (negative) and EBR-9 HS (positive), and a low-distortion x-ray mask with W–Ti alloy absorber were used. The SAW BPF devices were fabricated by forming Al transducer patterns on an LiNbO3 substrate. The Al film was chemically etched with an acid etchant. The frequency characteristic of the fabricated SAW BPF devices was evaluated. As a result, it is confirmed that the SAW BPF devices satisfied the superior specification, with a center frequency of f0± 2 MHz, an insertion loss of < 15 dB and a band width of 30 MHz. It is thus demonstrated that the x-ray lithography has the potential for use in the fabrication of submicron SAW devices.

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