Alcohol Modified RTV Silicone Encapsulation for Integrated Circuit Device Packaging
- 1 December 1983
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 6 (4) , 485-493
- https://doi.org/10.1109/tchmt.1983.1136218
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Ultrahigh sensitivity uranium analyses using fission track counting: Further analyses of semiconductor packaging materialsJournal of Radioanalytical and Nuclear Chemistry, 1982
- A Moisture Protection Screening Test for Hybrid Circuit EncapsulantsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1981
- Encapsulation of integrated circuitsProceedings of the IEEE, 1969