Impact of trench aspect ratio on microstructure variation in as-deposited and annealed damascene Cu interconnect lines
- 1 October 2004
- Vol. 35 (7) , 575-587
- https://doi.org/10.1016/j.micron.2004.01.003
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
- Impact of trench aspect ratio on microstructure variation in as-deposited and annealed damascene Cu interconnect linesMicron, 2004
- Microstructure Analysis in As-deposited and Annealed Damascene Cu Interconnects using OIMAIP Conference Proceedings, 2003
- Mechanisms for microstructure evolution in electroplated copper thin films near room temperatureJournal of Applied Physics, 1999
- Stress and grain growth in thin filmsJournal of the Mechanics and Physics of Solids, 1996
- The Influence of Texture and Grain Boundary Character Distribution on the Reliability of Aluminium Thin FilmsMaterials Science Forum, 1996
- On annealing twins and CSL distributions in F.C.C. polycrystalsPhysica Status Solidi (a), 1992
- Interfacial energies of tilt boundaries in aluminium. Experimental and theoretical determinationScripta Metallurgica, 1971