Low stress polymer die attach adhesive for plastic packages
- 17 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 1 reference indexed in Scilit:
- Life Estimation For IC Plastic Packages Under Temperature Cycling Based on Fracture MechanicsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987