Main monolithic memory

• 1 October 1971
• journal article
• Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Journal of Solid-State Circuits
• Vol. 6  (5) , 276-279
• https://doi.org/10.1109/jssc.1971.1050186

Abstract

Keywords

• DECODING
• CHIP
• POWER DISSIPATION
• SWITCHES
• MANUFACTURING
• PACKAGING