New composite organic dielectric for high performance flip chip single chip packages
- 22 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1015-1021
- https://doi.org/10.1109/ectc.1997.606295
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Microelectronics Packaging/Interconnect: An Industry in TransitionPublished by Springer Nature ,1991