The Mechanism of Electropolishing of Copper in Phosphoric Acid Solutions

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Abstract
Experiments with a composite anode having projections and recesses on its surface insulated from each other showed that the current distribution between projections and recesses underwent very little change when the total current fell and polishing conditions were established. This called for a radical revision of previous views of electropolishing, and prompted a quantitative investigation of the smoothing efficiency under different conditions on a surface of standard roughness. The observed efficiencies were compared with those calculated for a wholly diffusion‐controlled distribution of attack (identical with primary current distribution) and for equal dissolution at all points on the surface. The conclusion reached is that the mode of smoothing in electrolytic (and chemical) polishing is not specific to these processes, but results solely from the variations in concentration gradient within the diffusion layer set up on the anode surface. For any surface of known shape there is, therefore, a maximum possible smoothing efficiency.

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