Measurement of the Elastic Moduli of Structural Adhesives by a Resonant Bar Technique
- 1 June 1976
- journal article
- Published by SAGE Publications in Journal of Mechanical Engineering Science
- Vol. 18 (3) , 149-158
- https://doi.org/10.1243/jmes_jour_1976_018_025_02
Abstract
A method of measuring the dynamic torsion and Young's moduli of a thin film of adhesive is described. The accuracy of the technique and its suitability for structural adhesives is discussed. Values of modulus obtained using this method are compared with values obtained from static and dynamic tests on bulk specimens of three epoxy adhesives.Keywords
This publication has 3 references indexed in Scilit:
- Stress analysis of adhesive-bonded lap jointsJournal of Strain Analysis, 1974
- Measurement of the flexural damping capacity and dynamic Young's modulus of metals and reinforced plasticsJournal of Physics D: Applied Physics, 1973
- A Resonant Bar Method for Determining the Elastic Properties of Thin LaminaJournal of Applied Physics, 1950