The Effect of Grain Size on Ductility and Impurity Content of Electroless Copper Deposits

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Abstract
The ductility of fine‐grained electroless copper deposited on substrates activated with fine catalytic particles is significantly lower than that of the deposit plated epitaxially on large‐grained copper. In order to obtain understanding of this grain size effect, electroless copper deposits with different grain sizes obtained by plating on different substrates were subjected to impurity analysis, ductility measurements, and scanning electron microscope observations. The results show that it is important to take into consideration the effect of hydrogen‐containing voids on the integrity of grain boundaries in addition to the “conventional grain size effect,” i.e., the known effect of grain boundaries as an obstacle to the slippage of crystal planes during plastic deformation.

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