Microchannel coolers for high-power laser diodes in copper technology

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Abstract
This paper describes as an alternative to the silicon technology the production, assembly, and performance of microchannel coolers in copper technology. A realization technique for these copper coolers is described for one specific cooler geometry with a stacked design of 5 microstructured copper plates. These 5 layers are bonded together by diffusion welding at a temperature near 800 degree(s)C. This bonding process allows the fabrication of 3 X 8 coolers in one step in which the 5 structured copper plates of a size of 100 X 150 mm2 are bonded together. The structuring procedure is currently done by etching and laser machining. Microchannels with a width of 60 - 100 micrometers and a depth of 300 micrometers are used in the experiments as microstructures for better comparability to already existing theoretical and experimental results. A thermal resistance of 0.44 K/W of these copper coolers is demonstrated for a device with a 10 mm laser diode bar mounted on the front edge of the cooler. Experimental results for this configuration reach an average laser diode power of 71.5 Watts from one single bar with a footprint of 0.6 X 10 mm2. The experimental results are compared to 3-D heat flow calculations.

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