Predicting plated-through-hole reliability in high temperature manufacturing processes
- 9 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Mathematical model of a plated-through-hole structure under a load induced by thermal mismatchPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Results of the IPC Copper Foil Ductility Round-Robin StudyPublished by ASTM International ,1987