Development of chip scale packages (CSP) for center pad devices

Publisher Website

22 November 2002

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

https://doi.org/10.1109/ectc.1997.606191

Abstract

No abstract available

Keywords

This publication has 2 references indexed in Scilit:

Investigation of stress singularity fields and stress intensity factors for cracks [IC packages
Published by Institute of Electrical and Electronics Engineers (IEEE) ,1996
Simplified and practical estimation of package cracking during reflow soldering process
Published by Institute of Electrical and Electronics Engineers (IEEE) ,1994