Two- and three-dimensional numerical modeling of copper electroplating for advanced ULSI metallization
- 1 May 2000
- journal article
- Published by Elsevier in Solid-State Electronics
- Vol. 44 (5) , 797-807
- https://doi.org/10.1016/s0038-1101(99)00276-2
Abstract
No abstract availableKeywords
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