A Fine Pitch And High Aspect Ratio Bump Array For Flip-chip Interconnection
- 24 August 2005
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 288-292
- https://doi.org/10.1109/iemt.1992.639906
Abstract
First Page of the Article Author(s) Yamada, H. Toshiba Corporation Konooh, Y. ; Saito, M.Keywords
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