Magnetic enhancement of cathodic arc deposition

Abstract
Cathodic arc deposition offers some important strengths as a deposition process. Material can be deposited at extremely rapid rates and large fractions of the evaporant are ionized, permitting control of the arrival energy of the depositing material. In addition, the depositing material can be directed by magnetic and electrostatic fields to specific locations within the chamber. In the present study, magnetic fields were used to achieve such control of a copper plasma, leading to a fourfold enhancement in the effective deposition rate and a simultaneous improvement in coating adhesion.

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