Electrical characterization of packaging environment using switching noise generating vehicle
- 30 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 219-221
- https://doi.org/10.1109/epep.1993.394551
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Considerations on package design for high speed and high pin count CMOS devicesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Computing Inductive Noise of Chip PackagesAT&T Bell Laboratories Technical Journal, 1984