Thermal Fatigue and Mechanical Reliability of FBGA Solder Joints.

• 1 January 2001
• journal article
• Published by Japan Institute of Electronics Packaging in Journal of The Japan Institute of Electronics Packaging
• Vol. 4  (1) , 56-62
• https://doi.org/10.5104/jiep.4.56

Abstract

Keywords

• FATIGUE AND MECHANICAL
• THERMAL FATIGUE
• MECHANICAL RELIABILITY
• FBGA SOLDER
• SOLDER JOINTS