Phase characterization and dielectric properties of a copper-cordierite electronic packaging system
- 1 November 1987
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 16 (6) , 423-426
- https://doi.org/10.1007/bf02655496
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Copper Interactions in Thick Film Multilayer Ceramics: Dielectric Blushing and PerformanceMRS Proceedings, 1986
- Electron diffraction of precipitates at copper-cordierite interfacesMaterials Letters, 1985