Thermosonic flip-chip bonding using longitudinal ultrasonic vibration
- 1 January 1998
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 21 (1) , 53-58
- https://doi.org/10.1109/96.659506
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
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- Soldering technology for optoelectronic packagingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Optimization of copper wire bonding on Al-Cu metallizationIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1995
- Controlled Collapse Reflow Chip JoiningIBM Journal of Research and Development, 1969