Analytical Modeling in Electronic Packaging Structures: Its Merits, Shortcomings and Interaction With Experimental and Numerical Techniques
- 1 June 1989
- journal article
- Published by ASME International in Journal of Electronic Packaging
- Vol. 111 (2) , 157-161
- https://doi.org/10.1115/1.3226522
Abstract
We discuss the role of theoretical and, in particular, analytical modeling in mechanical problems for electronic packaging, including requirements for a feasible theoretical model, how such a model is developed, the role of mathematics, what can be gained by using theoretical modeling, as well as the interaction of analytical, numerical (computer-aided) and experimental models. Peculiarities of theoretical modeling in Structural Analysis are also briefly discussed.Keywords
This publication has 0 references indexed in Scilit: