Challenges in determining electronics equipment take-back levels
- 1 July 1998
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C
- Vol. 21 (3) , 225-232
- https://doi.org/10.1109/3476.720421
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
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- Environmentally sound management of electronic scrap and the Basel Convention on control of transboundary movements of hazardous wastes and their disposalPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
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- Investigation of electronic assembly design alternatives through production modeling of life cycle impacts, costs, and yieldIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C, 1997