Thermal conductivity of an electrically conducting epoxy below 3 K
- 1 December 1977
- journal article
- letter
- Published by AIP Publishing in Review of Scientific Instruments
- Vol. 48 (12) , 1715
- https://doi.org/10.1063/1.1134939
Abstract
Electronic conduction enhances the thermal conductivity of a commerical silver‐filled epoxy below 0.5 K. When used as a bonding agent between two metals, this epoxy provides improved thermal contact; however, when one or both of the materials to be joined is a dielectric, no advantage is obtained over a pure epoxy joint due to the presence of the thermal boundary resistance.Keywords
This publication has 6 references indexed in Scilit:
- Switching behaviour and DC electrical conductivity of epoxy-resin/metal-powder compositesJournal of Physics D: Applied Physics, 1976
- The thermal conductivity of epoxy-resin/metal-powder composite materials from 1.7 to 300KJournal of Physics D: Applied Physics, 1976
- Influence of the Kapitza resistance on the thermal conductivity of filled epoxiesCryogenics, 1975
- Electrically conducting mixturesJournal of Physics D: Applied Physics, 1973
- Selection of a thermal bonding agent for temperatures below 1 KCryogenics, 1970
- Low-Temperature Thermal Conductivity of a Suspension of Copper ParticlesJournal of Applied Physics, 1970