Preparation and Electrical Properties of Polytetracyano-ethylene Copper Chelate Film

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Abstract
The preparation and physical properties of polytetracyano-ethylene (TCNE) copper chelate film were studied. The reaction of TCNE with copper consists of the first rapid and the second slow processes. An optimized condition for the preparation was to heat for 9 to 24 hours at 400°C. Element analysis of carbon and copper, and electron probe microanalysis revealed nonuniform distribution of copper atoms across the film, about 30 % near the surface based on the copper plate and 20 % on the opposite side. The electrical conductivity shows a remarkable anisotropic effect in both directions of perpendicular and along the base side, with activation energy of 0.1 to 0.5 eV, and the highest conductivity of 10-1 mho.cm-1. Heat treatment changes the distribution of copper, free radical concentration, electrical conductivity, and dielectric properties of the film. Nonohmic conduction appears on the perpendicular direction and was interpreted as space-charge-limited mechanism. The excess copper atoms over the chelate composition (TCNE: Cu=2:1) may contribute to the high conductivity on the base surface and dielectric properties.

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