Analysis and Development of a Thermocompression Bond Schedule for Beam Lead Devices
- 1 September 1972
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
- Vol. 8 (3) , 22-26
- https://doi.org/10.1109/tphp.1972.1136577
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Compliant bonding—A new technique for joining microelectronic componentsIEEE Transactions on Electron Devices, 1968