The mechanical behavior of interconnect materials for electronic packaging
- 1 May 1996
- journal article
- Published by Springer Nature in JOM
- Vol. 48 (5) , 49-53
- https://doi.org/10.1007/bf03222944
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Thermal Fatigue in Solder JointsJOM, 1988