Comment on “Effect of applied potential and surface dissolution on the creep behavior of copper”
- 30 November 1974
- journal article
- Published by Elsevier in Scripta Metallurgica
- Vol. 8 (11) , 1231-1233
- https://doi.org/10.1016/0036-9748(74)90336-6
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
- Effect of applied potential and surface dissolution on the creep behavior of copperActa Metallurgica, 1974
- Metallographic study of the surface layerActa Metallurgica, 1973
- The effect of anodised surface layer on the creep behaviour of polycrystalline aluminiumScripta Metallurgica, 1971
- Preyield Plastic Deformation in Copper PolycrystalsJournal of Applied Physics, 1969
- Comparative Surface Hardening Effects of Edge and Screw Dislocations in Aluminum Single CrystalsJournal of Applied Physics, 1962
- Preferential Plastic Deformation in the Surface Region of Al and α-Fe Single CrystalsJournal of the Physics Society Japan, 1961
- Transient Creep in Pure MetalsNature, 1951