ESCA study of the adhesion of Ag, Cu and Ni to polysiloxane resins used in the semiconductor industry
- 1 August 1983
- journal article
- research article
- Published by Wiley in Surface and Interface Analysis
- Vol. 5 (4) , 161-166
- https://doi.org/10.1002/sia.740050407
Abstract
No abstract availableKeywords
This publication has 12 references indexed in Scilit:
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- Chemical basis of adhesion to electrical discharge treated polyethylenePolymer, 1979
- Theories of adhesion and uses of adhesives: a reviewPolymer, 1978
- Surface analysis of polysiloxane/metal oxide interfacesJournal of Materials Science, 1977