The Activation Energy of Void Growth from Fracture Measurements during Creep
- 1 January 1969
- journal article
- Published by Taylor & Francis in Metal Science Journal
- Vol. 3 (1) , 67
- https://doi.org/10.1179/msc.1969.3.1.67
Abstract
No abstract availableThis publication has 6 references indexed in Scilit:
- The Mechanism of Cavity Growth in Copper during High-Temperature FatigueMetal Science Journal, 1968
- Growth op grain boundary bubbles in materials containing inert gases: A comment on the paper of russell and velaJournal of Nuclear Materials, 1967
- The stress-rupture characteristics of copper and alloys containing boron and heliumJournal of Nuclear Materials, 1967
- A theory of grain boundary degeneration in materials which contain an inert gasJournal of Nuclear Materials, 1967
- Creep in face-centred cubic metals with special reference to copperActa Metallurgica, 1959
- Grain boundary sliding and intercrystalline crackingActa Metallurgica, 1959