Failure analysis of die-attachment on static random access memory (SRAM) semiconductor devices
- 1 January 1987
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 16 (1) , 7-11
- https://doi.org/10.1007/bf02667785
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- The Quality of Die-Attachment and Its Relationship to Stresses and Vertical Die-CrackingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983